Contact: Manager Zhang 13823551369
Manager Chen 13316540440
Mail box: 3265465343@qq.com
Fax: 0755-84826339
Website: www.szhtgj.cn
Address: 3020, Longcheng Avenue, Longgang District, Shenzhen, Guangdong Province
Introduction of electronic potting glue:
Electronic potting glue is a potting material with waterproof, moisture-proof, heat-conducting, insulating sealing functions, which protects electronic components. It can also be called potting glue, potting silica gel, electronic glue, encapsulating silica gel, etc.
Electronic potting silica gel uses:
Electronic potting silica gel is mainly used for packaging, sealing, filling, anti-pressure of electronic components. It has excellent adhesion, sealing thermal stability to PC (electronic insulating sheet), PMMA (plexiglass, acrylic), PCB, CPU. Electronic potting silica gel is divided into addition type electronic potting silica gel condensation type electronic potting silica gel.
Features of electronic potting glue:
1. With ozone resistance chemical corrosion resistance;
2. It has the functions of waterproof, moisture-proof, dust-proof, sealing, heat conduction, insulation corrosion resistance;
3. Low viscosity, good fluidity, simple operation, can be poured to subtle places;
4. The flame retardant effect is good, its flame retardancy can reach UL94-V1 UL94-V0, it fully meets the requirements of the EU RoHS directive;
5. Product performance is adjustable, color, hardness, viscosity, operating time can be adjusted as needed.
Electronic potting glue operation:
1. First, fully stir the A component to make the sedimentation filler fully mix, the B component to shake well.
2. The proportion of component B must be strictly in accordance with the product description.
3. When electronic potting glue is used, it can be defoamed as needed. The mixed glue A B can be fully stirred put into a vacuum container, degassed at 0.01MPa for 3 minutes, then can be poured for use.
4. Electronic potting silica gel is an addition molding curing product. After being poured, it is cured at room temperature heated to cure. After the basic curing, it enters the next process. It takes 24 hours to fully cure. Ambient temperature humidity have a great influence on curing.
Note on electronic potting:
1. This product is a non-dangerous product. If it enters the mouth eyes accidentally, it can be washed with water;
2. The silica gel should be sealed stored, the stirred silica gel should be used up at one time;
3. If the storage time is too long, the silica gel may be stratified, just stir evenly during use, the performance of the silica gel will be affected;
4. Addition type silica gel can be mixed with condensation type silica gel, otherwise the silica gel will be "poisoned" the silica gel will be cured;
5. Do touch water, impurities, organotin catalysts, acids, alkalis other organic compounds containing nitrogen, phosphorus, sulfur during use. Mixing these substances will cause the silica gel to "poison" cause the silica gel to solidify.
Electronic potting silica gel parameters:
Type of vulcanization | Condensed | Addition molding | |||||||||||
组份 | A | B | A | B | A | B | A | B | A | B | A | B | |
Before curing | appearance | Colorless transparent viscous liquid | Colorless slightly yellow transparent liquid | Black viscous liquid | Colorless slightly yellow transparent liquid | Dark gray | white | Dark gray | white | Dark gray | white | transparent | 透明 |
Dynamic viscosity (mPa.s) | 3000±500 | 3000±500 | 2000~3000 | 2500~3500 | 2000~3000 | 600-1000 | |||||||
Operational performance | A/B two-component mixing weight ratio | 10:01 | 10:01 | 1:01 | 1:01 | 1:01 | 1:01 | ||||||
Operating time (min) | 60~120 | 60~120 | 60~120 | 60~120 | 60~120 | 60~120 | |||||||
Basic curing time (h) | 3 | 3 | 8 | 8 | 8 | 8 | |||||||
Full vulcanization time (h) | 24 | 24 | 20 | 20 | 20 | 20 | |||||||
Hardness (Shore A) | 15±3 | 15±3 | 55±5 | 45±5 | 25±5 | 0 | |||||||
After curing | Cohesiveness | 好 | 好 | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | ≤2.2×10-4 | ||||||
Thermal conductivity [W(m.k)] | ≥0.2 | ≥0.4 | ≥0.8 | ≥0.8 | ≥0.8 | ≥0.2 | |||||||
Dielectric absolute number (kV/mm) | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | ≥25 | |||||||
Dielectric constant (1.2MHz) | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | |||||||
Volume resistivity (Ω·cm) | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | ≥1.0×1016 | |||||||
Flame retardant | UL94-V1 | UL94-V1 | UL94-V1 | UL94-V1 | UL94-V1 | UL94-V1 | |||||||
standard packaging | 25kg/barrel | AB glue 25kg/barrel each |
Note: The above parameters are only conventional parameters. If you have special requirements, please contact our company; the hardness, viscosity, operating time after curing can be specially adjusted provided according to customer needs.
Contact: Manager Zhang 13823551369
Manager Chen 13316540440
Mail box: 3265465343@qq.com
Fax: 0755-84826339
Address: 3020, Longcheng Avenue, Longgang District, Shenzhen, Guangdong Province
Hongtu Mobile Station | Ali shop |