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Shenzhen Hongtu Silicone Technology Co., Ltd.

Contact: Manager Zhang 13823551369

               Manager Chen 13316540440

Mail box: 3265465343@qq.com

Fax: 0755-84826339

Website: www.szhtgj.cn

Address: 3020, Longcheng Avenue, Longgang District, Shenzhen, Guangdong Province

Electronic potting glue


    Product Introduction:
    Electronic potting glue is a potting material with waterproof, moisture-proof, heat-conducting, insulating sealing functions, which protects electronic components. It can also be called potting glue, potting silica gel, electronic glue, encapsulating silica gel, etc.
  • Product description

Introduction of electronic potting glue:

Electronic potting glue is a potting material with waterproof, moisture-proof, heat-conducting, insulating  sealing functions, which protects electronic components. It can also be called potting glue, potting silica gel, electronic glue, encapsulating silica gel, etc.


Electronic potting silica gel uses:

Electronic potting silica gel is mainly used for packaging, sealing, filling,  anti-pressure of electronic components. It has excellent adhesion, sealing  thermal stability to PC (electronic insulating sheet), PMMA (plexiglass, acrylic), PCB,  CPU. Electronic potting silica gel is divided into addition type electronic potting silica gel  condensation type electronic potting silica gel.


Features of electronic potting glue:

1. With ozone resistance  chemical corrosion resistance;


2. It has the functions of waterproof, moisture-proof, dust-proof, sealing, heat conduction, insulation  corrosion resistance;


3. Low viscosity, good fluidity, simple operation,  can be poured to subtle places;


4. The flame retardant effect is good,  its flame retardancy can reach UL94-V1  UL94-V0,  it fully meets the requirements of the EU RoHS directive;


5. Product performance is adjustable, color, hardness, viscosity,  operating time can be adjusted as needed.



Electronic potting glue operation:

1. First, fully stir the A component to make the sedimentation filler fully mix,  the B component to shake well.


2. The proportion of component B must be strictly in accordance with the product description.


3. When electronic potting glue is used, it can be defoamed as needed. The mixed glue A  B can be fully stirred  put into a vacuum container, degassed at 0.01MPa for 3 minutes,  then can be poured for use.


4. Electronic potting silica gel is an addition molding curing product. After being poured, it is cured at room temperature  heated to cure. After the basic curing, it enters the next process. It takes 24 hours to fully cure. Ambient temperature  humidity have a great influence on curing.



Note on electronic potting:

1. This product is a non-dangerous product. If it enters the mouth  eyes accidentally, it can be washed with water;


2. The silica gel should be sealed  stored,  the stirred silica gel should be used up at one time;


3. If the storage time is too long, the silica gel may be stratified, just stir evenly during use,  the performance of the silica gel will  be affected;


4. Addition type silica gel can  be mixed with condensation type silica gel, otherwise the silica gel will be "poisoned"  the silica gel will  be cured;


5. Do  touch water, impurities, organotin catalysts, acids, alkalis  other organic compounds containing nitrogen, phosphorus,  sulfur during use. Mixing these substances will cause the silica gel to "poison"  cause the silica gel to  solidify.



Electronic potting silica gel parameters:

Type of vulcanization

Condensed

Addition molding

组份

A

B

A

B

A

B

A

B

A

B

A

B

Before curing

appearance

Colorless transparent viscous liquid

Colorless  slightly yellow transparent liquid

Black viscous liquid

Colorless  slightly yellow transparent liquid

Dark gray

white

Dark gray

white

Dark gray

white

transparent

透明


Dynamic viscosity (mPa.s)

3000±500

3000±500

2000~3000

2500~3500

2000~3000

600-1000

Operational performance

A/B two-component mixing weight ratio

10:01

10:01

1:01

1:01

1:01

1:01


Operating time (min)

60~120

60~120

60~120

60~120

60~120

60~120


Basic curing time (h)

3

3

8

8

8

8


Full vulcanization time (h)

24

24

20

20

20

20


Hardness (Shore A)

15±3

15±3

55±5

45±5

25±5

0

After curing

Cohesiveness

≤2.2×10-4

≤2.2×10-4

≤2.2×10-4

≤2.2×10-4


Thermal conductivity [W(m.k)]

≥0.2

≥0.4

≥0.8

≥0.8

≥0.8

≥0.2


Dielectric absolute number (kV/mm)

≥25

≥25

≥25

≥25

≥25

≥25


Dielectric constant (1.2MHz)

3.0~3.3

3.0~3.3

3.0~3.3

3.0~3.3

3.0~3.3

3.0~3.3


Volume resistivity (Ω·cm)

≥1.0×1016

≥1.0×1016

≥1.0×1016

≥1.0×1016

≥1.0×1016

≥1.0×1016


Flame retardant

UL94-V1

UL94-V1

UL94-V1

UL94-V1

UL94-V1

UL94-V1

standard packaging

25kg/barrel

AB glue 25kg/barrel each


Note: The above parameters are only conventional parameters. If you have special requirements, please contact our company; the hardness, viscosity,  operating time after curing can be specially adjusted  provided according to customer needs.


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Contact information

液体硅胶,食品硅橡胶,人体硅橡胶厂家 Contact: Manager Zhang 13823551369

                   Manager Chen 13316540440

液体硅胶,食品硅橡胶,人体硅橡胶厂家 Mail box: 3265465343@qq.com

液体硅胶,食品硅橡胶,人体硅橡胶厂家 Fax: 0755-84826339

液体硅胶,食品硅橡胶,人体硅橡胶厂家 Address: 3020, Longcheng Avenue, Longgang District, Shenzhen, Guangdong Province


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